| | intuitive understanding of high-speed transmission line behavior. This is an important topic for anyone concerned with design, analysis, troubleshooting, or qualification of high-speed interconnects like backplanes, printed circuit boards, high-speed serial links, cables, connectors, sockets etc.
Using a compact time domain reflectometer (TDR) developed by the presenter we will perform a variety of life, real-time demonstrations (free-hand experiments) to investigate topics like delay and characteristic impedance, reflections, impedance mismatches, parasitics, lumped and distributed crosstalk, differential signaling, and others. We will show how to extract quantitative data for transmission lines and parasitics and use them to build equivalent models to be used in transmission path simulation.
Towards the end we will compare TDR with the traditionally more common analysis based on network analyzers and show strengths and weaknesses in either approach.
 | | Intended Audience:
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Test engineers, product engineers, characterization engineers, application engineers, chip, |