| | involved (device, test equipment, interface), as well as the interaction between them. The boundaries between digital and analog disappear. Connections have to be treated as transmission lines, with every little imperfection impacting system performance, deteriorating test accuracy, and reducing yield. Maintaining signal integrity is paramount in order to achieve meaningful results, and it requires good knowledge of signal path behavior, proper choice of termination techniques, and good design of the interface. While the tester itself is usually given and not easily modified, large improvements are possible by careful design of the interconnecting load board or probe interface. Apart from theoretical knowledge, methods to quantify the performance of a given design by measurements are necessary as well.
This is the most extensive venture into high-speed test. It covers all the topics of the 1-day class but in much more detail, plus several additional ones (e.g. scope & probes, and ATE specific techniques), and also contains many more real-life examples. Live demonstrations with a TDR (time domain reflectometer) make signal path behavior very intuitive. Practical exercises will introduce the participants to modeling, simulating and optimizing their signal paths using PSpice and field solvers.
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Test engineers, product engineers, characterization engineers, application engineers, chip, |